Cook Vortex Cooling™ packing cases – the only packing case design fully compliant with API 618, 5th edition – significantly improve heat transfer, resulting in extended sealing component life.
- Fully compliant with API 618, 5th edition
- Cooler operation extends sealing component life
- Most efficient heat transfer
- Eliminates gas-to-coolant leakage
- Simplifies installation and maintenance
- Easy access for clean-out
Superior Heat Transfer
Cook Vortex Cooling packing cases feature single-piece cups with tangential coolant channels. The tangential configuration of the coolant channels creates turbulent flow and higher coolant velocity, virtually eliminating dead space. The entire volume of coolant passes through a single, continuous cooling channel from inlet to outlet, resulting in superior heat transfer.
The Vortex Cooling packing case complies with API 618, unlike the “plate and channel” design currently used in moderate- to high-pressure applications.
The Cook Vortex Cooling design may be used in place of conventional pressed-fit coolant cups, which have the potential for gas-to-coolant leakage at higher pressures. The single-piece construction of the Vortex Cooling cup eliminates pressed-fit cup leakage. The design also has no rod-encircling O-rings to hamper maintenance.
The straight-sided tangential cooling channels in Vortex Cooling cases offer superior accessibility through exterior cleaning ports for easy removal of blockage. Even the hardest deposits can be removed quickly with a hand drill.